An all-around description of the equipment:
        The principle for it is that the operator picks out the chips from the element through a visual system. After turning 180°, conductive resin and coil are bound together through heating and pressing, thus forming the return circuit. The process includes putting in materials, gelatinizing, binding beforehand, final binding, test, output, and cutting.
The module of putting materials: the module inputs the antenna reel loading belt through material-inputting tube to the first techniques module. A buffer and a guidance controller ensure the correct place of the loading belt.
Gelatinizing module: adhesive module with the module gelatinizing system sticks the ACP or NCP to the fixed location on the antenna bottom material loading belt.
Binding beforehand module: the module picks up chips from wafer, turns 180°, moves chips onto the binding location, then sticks to the antenna bottom material loading belt.
Final binding module: the final binding module carrying heating and pressing unit realizes the inner link of chips and antenna. For example: using hot pressing head(heat amount, pressure and time) to solidify ACP or NCP bonds.
Test module: the module uses reading head to inspect the function of encapsulated RFID labels. (the function is to test whether being passed or not ). Disqualified Inlay is marked by ink dot.
Output module: the standard output module is a reel module. It rolls the antenna reel upwards to output reel. It can also cut the final materials in a single row.
        The technical features and productive capability are shown as follows:
1. Ensuring the inner quality: high precision, fine reliability, function of dispelling static.
2. Processing completely: parent metal materials can be various polyesters (such as PET, PP, PVC, etc.) with the thickness of 50-100um. Antenna can be aluminium etching or bronze etching. Printed by inks or so. A lot kinds of wafers such as 6 inches, 8 inches can be identified. A variety of HP and UHP electronic labels can be produced.
3. High productive efficiency: the highest speed can achieve 11,000 per hour. The annual capacity can run up to 7.7 million.
4. ensuring the quality of the final products’ appearance: being drove by servo-actuator, tensility can be managed, it can automatically rectify a deviation.
5. Flexible productive capability: Products with all kinds of batch (large batch or small batch, with all kinds of types), all kinds of special materials, all kinds of shape and size can be made successfully.
6. A high nondefective rate: nondefective rate > 99.7%
7. little chips can be handled: it can bind little chips: 0.4X0.4mm
8. High precision of the equipment: it has 12 visual orientation systems with the function of precise orientation, wafer inspection, rectifying the deviation of chips, locating the binding position. The precision of wafer binding is not less than ±50um@3δ, that of binding pressure in not less than ±5%, with the least being ±0.1N, and the precision of temperature control is within 5 degree.
RFID laboratory:
We have metaloscope, tensile strength tester, frequency analyzer, high-low temperature controller, static tester and some other instruments. The wafer binding quality can be highly improved through these instruments.
Metaloscope: the maximum magnification is 1000. It can be used to inspect the wafer binding position and extent in order to better adjust the techniques parameter of the instruments.
Tensile strength tester: It is used to test the binding degree of wafer and antenna. It is the major judgment for whether the products are good or bad.
Frequency analyzer: It inspects products and makes invalidation analysis through testing the frequency of HF and UHF products.
High-low temperature controller: It is used to set temperature for different environments, to do the aging test with different temperatures of products, and to validate materials.
Static tester: It is used to test the degree of static in the process of production and using anti-static measure to prevent the damage to the products.